Dimensity 6100+ vs Helio G200
The Dimensity 6100+ and the Helio G200 are both entry-level chips made by MediaTek. In Geekbench 6, the two chips are nearly level in multi-core (1,870 vs 1,880), but the Dimensity 6100+ is 3% faster in single-core. In 3DMark Steel Nomad Light, a graphics test, the Helio G200 scores 21% higher (160 vs 132).
Benchmarks head to head
Full chipset rankingMulti-core Geekbench 6
Nearly levelSingle-core Geekbench 6
Dimensity 6100+ +3%Graphics 3DMark Steel Nomad Light
Helio G200 +21%Higher is better. Bars are relative to the faster chip in each test. A dash means we don’t have a reliable result for that chip yet.
Key facts
Specs from the chip makers. The better result in each benchmark is highlighted.
| Dimensity 6100+ | Helio G200 | |
|---|---|---|
| Maker | MediaTek | MediaTek |
| Class | Entry | Entry |
| Announced | Jul 2023 | May 2025 |
| Process | 6 nm TSMC N6 | 6 nm TSMC N6 |
| CPU | 8 cores 2× 2.2 GHz + 6× 2.0 GHz | 8 cores 2× 2.2 GHz + 6× 2.0 GHz |
| Max CPU speed | 2.2 GHz | 2.2 GHz |
| GPU | Mali-G57 MC2 | Mali-G57 MC2 |
| 5G modem | Built-in 5G | 4G only |
| Place in our ranking | #98 of 110 | #96 of 110 (better) |
| Geekbench 6 single-core | 690 (better) | 670 |
| Geekbench 6 multi-core | 1,870 | 1,880 |
| Graphics (3DMark Steel Nomad Light) | 132 | 160 (better) |
| Phones in our database | 1 phone | 3 phones |
| Best-rated phone | Samsung Galaxy XCover7 4.5 | REDMI Note 15 Pro 6.5 |
| Newest phone | Samsung Galaxy XCover7 Jan 2024 | Ulefone Armor 24 Pro Aug 2026 |
Phones with the Dimensity 6100+
1 phone in our database, best rated first.
-
4.5
Samsung Galaxy XCover7
6.6″ 60 Hz, 50 MP camera, 4,050 mAh
No US price + Compare
Phones with the Helio G200
3 phones in our database, best rated first.
-
6.5
REDMI Note 15 Pro
6.77″ 120 Hz, 200 MP camera, 6,500 mAh
No US price + Compare -
5.6
Ulefone Armor 24 Pro
6.78″ 120 Hz, 64 MP camera, 22,000 mAh
No US price + Compare -
5.3
Ulefone Armor 22 Pro
6.58″ 120 Hz, 64 MP camera, 6,600 mAh
No US price + Compare
Dimensity 6100+ vs Helio G200: FAQ
Which is faster, the Dimensity 6100+ or the Helio G200?
In Geekbench 6, the two chips are nearly level in multi-core (1,870 vs 1,880), but the Dimensity 6100+ is 3% faster in single-core. In 3DMark Steel Nomad Light, a graphics test, the Helio G200 scores 21% higher (160 vs 132). Real-world speed also depends on how well each phone keeps the chip cool and on its software.
Is the Dimensity 6100+ or the Helio G200 better for gaming?
3DMark Steel Nomad Light measures graphics performance, which matters most for games. The Helio G200 scores 21% higher than the Dimensity 6100+ (160 vs 132). Cooling, screen refresh rate and game support also make a difference, so check the phones themselves.
Which is newer, the Dimensity 6100+ or the Helio G200?
The Helio G200 is newer: it was announced in May 2025, while the Dimensity 6100+ was announced in July 2023.
Which phones use the Dimensity 6100+ and the Helio G200?
The Dimensity 6100+ powers one phone in our database: the Samsung Galaxy XCover7. The Helio G200 powers 3 phones in our database, including the REDMI Note 15 Pro, Ulefone Armor 24 Pro and Ulefone Armor 22 Pro.
Where do these benchmark scores come from?
They are reference results for each chip: the median of several Geekbench 6 runs on retail phones. The 3DMark Steel Nomad Light graphics score is the median of the results for retail phones with the chip in the official ranking of UL, the maker of 3DMark. The same chip can score a little differently from phone to phone, depending on cooling, clock speeds and software.
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