Dimensity 8500 vs Snapdragon 8 Gen 3
The Dimensity 8500 is an upper mid-range chip from MediaTek, and the Snapdragon 8 Gen 3 is a flagship chip from Qualcomm. In Geekbench 6, the Snapdragon 8 Gen 3 is 4% faster in multi-core (6,750 vs 6,520) and 36% faster in single-core. In 3DMark Steel Nomad Light, a graphics test, the Snapdragon 8 Gen 3 scores 14% higher (1,642 vs 1,443).
Benchmarks head to head
Full chipset rankingMulti-core Geekbench 6
Snapdragon 8 Gen 3 +4%Single-core Geekbench 6
Snapdragon 8 Gen 3 +36%Graphics 3DMark Steel Nomad Light
Snapdragon 8 Gen 3 +14%Higher is better. Bars are relative to the faster chip in each test. A dash means we don’t have a reliable result for that chip yet.
Key facts
Specs from the chip makers. The better result in each benchmark is highlighted.
| Dimensity 8500 | Snapdragon 8 Gen 3 | |
|---|---|---|
| Maker | MediaTek | Qualcomm |
| Class | Upper mid-range | Flagship |
| Announced | Jan 2026 | Oct 2023 |
| Process | 4 nm TSMC | 4 nm TSMC |
| CPU | 8 cores 1× 3.4 GHz + 3× 3.2 GHz + 4× 2.2 GHz | 8 cores 1× 3.3 GHz + 3× 3.2 GHz + 2× 3.0 GHz + 2× 2.3 GHz |
| Max CPU speed | 3.4 GHz | 3.3 GHz |
| GPU | Mali-G720 MC8 | Adreno 750 |
| 5G modem | Built-in 5G | Built-in 5G |
| Place in our ranking | #27 of 102 | #25 of 102 (better) |
| Geekbench 6 single-core | 1,620 | 2,200 (better) |
| Geekbench 6 multi-core | 6,520 | 6,750 (better) |
| Graphics (3DMark Steel Nomad Light) | 1,443 | 1,642 (better) |
| Phones in our database | 3 phones | 21 phones |
| Best-rated phone | Motorola Edge 70 Pro 8.2 | Xiaomi 14 Ultra 8.5 |
| Lowest US launch price | — | $549 REDMAGIC 10 Air |
| Newest phone | Xiaomi 17T May 2026 | vivo X Fold5 Jun 2025 |
Phones with the Dimensity 8500
3 phones in our database, best rated first.
-
8.2
Motorola Edge 70 Pro
6.78″ 144 Hz, 50 MP camera, 6,500 mAh
No US price + Compare -
7.9
Xiaomi 17T
6.59″ 120 Hz, 50 MP camera, 6,500 mAh
No US price + Compare -
7.6
POCO X8 Pro
6.59″ 120 Hz, 50 MP camera, 6,500 mAh
No US price + Compare
Phones with the Snapdragon 8 Gen 3
21 phones in our database, best rated first.
-
8.5
Xiaomi 14 Ultra
6.73″ 120 Hz, 50 MP camera, 5,000 mAh
No US price + Compare -
8.4
HONOR 400 Pro
6.7″ 120 Hz, 200 MP camera, 5,300 mAh
No US price + Compare -
8.3
vivo X Fold5
8.03″ 120 Hz, 50 MP camera, 6,000 mAh
No US price + Compare -
8.3
HONOR Magic6 Pro
6.8″ 120 Hz, 50 MP camera, 5,600 mAh
No US price + Compare
Dimensity 8500 vs Snapdragon 8 Gen 3: FAQ
Which is faster, the Dimensity 8500 or the Snapdragon 8 Gen 3?
In Geekbench 6, the Snapdragon 8 Gen 3 is 4% faster in multi-core (6,750 vs 6,520) and 36% faster in single-core. In 3DMark Steel Nomad Light, a graphics test, the Snapdragon 8 Gen 3 scores 14% higher (1,642 vs 1,443). Real-world speed also depends on how well each phone keeps the chip cool and on its software.
Is the Dimensity 8500 or the Snapdragon 8 Gen 3 better for gaming?
3DMark Steel Nomad Light measures graphics performance, which matters most for games. The Snapdragon 8 Gen 3 scores 14% higher than the Dimensity 8500 (1,642 vs 1,443). Cooling, screen refresh rate and game support also make a difference, so check the phones themselves.
Which is newer, the Dimensity 8500 or the Snapdragon 8 Gen 3?
The Dimensity 8500 is newer: it was announced in January 2026, while the Snapdragon 8 Gen 3 was announced in October 2023.
Which phones use the Dimensity 8500 and the Snapdragon 8 Gen 3?
The Dimensity 8500 powers 3 phones in our database, including the Motorola Edge 70 Pro, Xiaomi 17T and POCO X8 Pro. The Snapdragon 8 Gen 3 powers 21 phones in our database, including the Xiaomi 14 Ultra, HONOR 400 Pro and vivo X Fold5. The lowest US launch price with this chip is $549, for the REDMAGIC 10 Air.
Where do these benchmark scores come from?
They are reference results for each chip: the median of several Geekbench 6 runs on retail phones. The 3DMark Steel Nomad Light graphics score is the median of the results for retail phones with the chip in the official ranking of UL, the maker of 3DMark. The same chip can score a little differently from phone to phone, depending on cooling, clock speeds and software.
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